Does the wording "Semiconductor Devices" include:
a) integrated circuits
b) hybrid circuits consisting of discrete components mounted to a printed circuit board and encapsulated in a module ?
Both examples mentioned are considered to be "Semiconductor Devices " in the sense of the mentioned Clause.
When applying fault conditions to an audio amplifier (scl. 4.3.9) to determine heating under fault conditions there are two possibilities to do this.
1. Adjusting the apparatus to deliver one-eighth of the non- clipped output power to the minimum rated load impedance [ 8 Ohms) and then changing the load to 4 Ohms without changing the adjustment.
2. Changing the load impedance to 4 Ohms, measuring the non-clipped output power into 4 Ohms, and then adjusting the output to one-eighth of the non-clipped output power.
Which possibility is to be used?